在多層板中的新式開槽式接地面結構 刊登日期:2014/05/21
  ‧ 專利名稱 具有屏蔽效應的缺陷接地結構
  ‧ 專利證書號 I445243
8570114
  ‧ 專利權人 國立臺灣大學
  ‧ 專利國家
    (申請日)
中華民國 (2010/09/08)
美國 (2010/10/12)
  ‧ 發明人 吳宗霖, 許育豪, 蔡仲豪,
 
技術摘要:
一種具有屏蔽效應的缺陷接地結構,包括一介電層、一缺陷金屬層、一接地金屬層以及至少一導電蕈狀結構。缺陷金屬層配置介電層中,且具有一線形開口。另外,導電蕈狀結構配置於缺陷金屬層與接地金屬層之間,並沿線形開口之延伸方向週期性地排列。其中導電蕈狀結構包括一蕈傘部與一蕈柄部。蕈傘部平行缺陷金屬層並與缺陷金屬層相距一距離,蕈傘部於缺陷金屬層上的投影區域涵蓋一段對應蕈傘部的線形開口。蕈柄部連接蕈傘部與接地金屬層。

A defected ground structure with shielding effect is provided. The structure includes a dielectric layer, a defected metal layer, a grounded metal layer and at least a conductive mushroom-like structure. The defected metal layer has a line-shaped opening and is disposed in the dielectric layer. The conductive mushroom-like structure is disposed between the defected metal layer and the grounded metal layer and is arranged along an extending direction of the line-shaped opening periodically. The conductive mushroom-like structure includes a fungating part and a stipe part. The fungating part is parallel to the defected metal layer and a distance is maintained away from the defected metal layer. The projection area of the fungating part on the defected metal layer covers a length of the line-shaped opening corresponding to the fungating part. The stipe part connects the fungating part and the grounded metal layer.



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