耦合裝置
刊登日期:2014/05/21
  ‧ 專利名稱 耦合裝置
  ‧ 專利證書號 I336972
8115694
  ‧ 專利權人 國立臺灣大學
  ‧ 專利國家
    (申請日)
中華民國 (2007/08/13)
美國 (2008/08/12)
 
  ‧ 發明人/PI 林怡成 ,洪國鋒 ,
  ‧ 單位 電信工程學研究所
  ‧ 簡歷/Experience
技術摘要 / Our Technology:
一種耦合裝置,包括一基板、一接地元件、一第一饋入導體以及一第二饋入導體。基板包括一第一表面以及一第二表面。接地元件設於該第二表面之上,該接地元件包括一第一部份、一第二部分、一環形槽孔以及一饋入槽孔,該環形槽孔介於該第一部份與該第二部分之間,該饋入槽孔的一第一端連接該環形槽孔。第一饋入導體設於該第一表面之上,並對應該環形槽孔,其中,該第一饋入導體耦合該接地元件以饋入一電流訊號。第二饋入導體設於該第一表面之上,並對應該饋入槽孔,其中,該第二饋入導體耦合該饋入槽孔以饋入一磁流訊號。

A coupling device is provided, including a substrate, a ground element, a first feed conductor and a second feed conductor. The substrate includes a first surface and a second surface. The ground element is disposed on the second surface, wherein the ground element includes a first portion, a second portion, an annular groove and a feed slot, the annular groove is located between the first portion and the second portion, enclosing the first portion, and a first end of the feed slot is connected to the annular groove. The first feed conductor is disposed on the first surface corresponding to the annular groove, wherein the first feed conductor couples the ground element to feed a current signal. The second feed conductor is disposed on the first surface corresponding to the feed slot, wherein second feed conductor couples the feed slot to feed a magnetic current.




專利簡述 / Intellectual Properties:




 

聯繫方式 / Contact:
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Email:ordiac@ntu.edu.tw 電話/Tel:02-3366-9945