切割矽泥回收方法
  ‧ 專利名稱 切割矽泥回收方法
  ‧ 專利證書號 I337983
US 8,034,313
  ‧ 專利權人 國立臺灣大學
  ‧ 專利國家
    (申請日)
中華民國 (2006/12/29)
美國 (2007/12/21)
  ‧ 發明人 藍崇文, 林彥志, 王珽玉, 戴怡德,
 
技術摘要:
本發明之切割矽泥回收係在於晶棒切割成矽晶片時,平均約有40%的矽因為切割線本身的寬度而損耗掉,這些矽泥以污泥的方式被丟棄或是回收碳化矽粒子後丟棄浪費了許多成本,若這些40%的切割矽泥可以回收再次成為矽晶棒生長的原料,就可以減低生產成本,其中該矽泥內除了矽、水及碳化矽之外,還包含了潤滑油或是乙二醇,以及切割線損耗的金屬等雜質,如果可以有效的去除後而留下矽原料,可以回收應用於太陽能晶體的原物料之用,更可以增加矽晶產量及降低成本。

In slicing a crystal bar into silicon wafers, an average about 40% of silicon would be loss due to the widths of slicing wires themselves. The fact that the silicon slurry is discarded as sludge or discarded after recovering silicon carbide particles causes a large waste of cost. If the silicon slurry (40% of silicon) could be recovered as the raw material for growing silicon crystal bars, the production cost would be lowered. The recovery method of silicon slurry according to the present invention could effectively obtain silicon raw material after removing impurities, which could recover the raw material used in solar crystals, further capable of increasing the silicon crystal production and lowering the cost.



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