電洞或電子注入高分子與預聚高分子,電洞或電子傳輸高分子與預聚高分子及其形成方法
  ‧ 專利名稱 電洞或電子傳導層材料及其形成方法
  ‧ 專利證書號 US7,615,603B2
  ‧ 專利權人 國立臺灣大學
  ‧ 專利國家
    (申請日)
美國 (2005/11/30)
  ‧ 發明人 謝國煌, 梁文傑, 涂兆輝, 郭立中, 楊貴惠 , 李君浩,
 
技術摘要:
The present invention discloses hole or electron injection polymers and prepolymers, hole or electron transport polymers and prepolymers, which comprises a plurality of conjugated or non-conjugated structures with electronic function and a plurality of connecting structures, wherein the connecting structure is used to connect different conjugated or non-conjugated structures with electronic function, and the connecting structure comprises any one or any combination of the following group: ether based group, ester based group, urethane based group, urea based group, carbonate based group, nitrogen atom based group, amide based group, and imide based group. Moreover, this invention also discloses a method for forming the mentioned charge injection or transport polymers and prepolymers. Additionally, this invention provides hole injection layer or hole transport layer or electron injection layer or electron transport layer comprising copolymers with a first structure unit with hole injecting/transporting property and a second structure unit with electron injecting/transporting property.




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