塗佈模組
  ‧ 專利名稱 塗佈模組
  ‧ 專利證書號 I496625
5837003
US9492836B2
  ‧ 專利權人 國立臺灣大學
  ‧ 專利國家
    (申請日)
中華民國 (2012/06/29)
美國 (2013/02/08)
韓國 (2013/05/02)
歐盟 (2013/05/14)
日本 (2013/06/14)
中國 (2013/06/27)
  ‧ 發明人 王安邦, 謝育文, 劉祐汝,
 
技術摘要:
一種塗佈模組,適於將一液體塗佈至一基材上。塗佈模組包括兩夾板以及一導流結構。夾板之間具有一狹縫,狹縫具有狹縫入口與狹縫出口。夾板之一具有一注入開口。導流結構將注入開口連通至狹縫入口。液體適於經由注入開口進入導流結構,並經由導流結構流動至狹縫入口,再經由狹縫入口流入狹縫內,並經由狹縫出口流出狹縫以塗佈至基材上。
A coating module is suitable to coat a liquid onto a substrate and includes two plates and a diversion structure, in which there is a slot between the plates, and the slot has a slot inlet and a slot outlet, and one of the plates has an injecting port. The diversion structure makes the injecting port communicated with the slot inlet, in which the liquid is configured to enter the diversion structure via the injecting port, and flow to the slot inlet through the diversion structure, then flow into the slot via the slot inlet and then outflows from the slot via the slot outlet to be coated onto the substrate.




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