中介層PCBM交鏈化與應用
  ‧ 專利名稱 製作中介層之方法
  ‧ 專利證書號 US8951922
  ‧ 專利權人 臺大
  ‧ 專利國家
    (申請日)
中華民國 (2013/01/22)
美國 (2013/03/13)
 
  ‧ 發明人/PI 林清富,錢奎羽,高紹軒,
  ‧ 單位 光電工程學研究所
  ‧ 簡歷/Experience
技術摘要 / Our Technology:
The present invention relates to a method for fabricating an interlayer, and particularly relates to a method for fabricating an interlayer PCBM which is difficult to be dissolved in organic solvents. The solubility of the interlayer (PCBM) in organic solvents is decreased by polymerization of the interlayer (PCBM). Therefore, the thickness of the interlayer (PCBM) can be efficiently controlled, and the yield rate and efficiency of photoelectric devices can be improved.




聯繫方式 / Contact:
臺大產學合作總中心 / Center of Industry-Academia Collaboration, NTU
Email:ordiac@ntu.edu.tw 電話/Tel:02-3366-9945