 技術摘要 / Our Technology： |
一種散熱載板結構改良，其包括有一導熱金屬底層，一電絕緣陶瓷中間層，及一具線路的金屬上層，該金屬上層中央處至少具有一缺口，而露出陶瓷中間層，電腦中央處理器，功率元件或發光二極體元件位於此缺口處，並藉由導熱膠固定於陶瓷中間層上。此改良之散熱載板結構因層數少，而有厚度較薄的優勢。
A package assembly with a heat dissipating structure includes a thermal conductive lower metal layer, an electric insulating ceramic layer, a patterned upper metal layer and an electronic component. The electric insulating ceramic layer is disposed on and bonded to the thermal conductive lower metal layer. The patterned upper metal layer is disposed on and bonded to the electric insulating ceramic layer. The patterned upper metal layer is a single-layered metal layer and has an opening from which the electric insulating ceramic layer is exposed. The electronic component is disposed in the opening of the patterned upper metal layer, mounted on the electric insulating ceramic layer through a thermally conductive adhesive or solder, and electrically connected to the patterned upper metal layer.
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| 專利簡述 / Intellectual Properties： |
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聯繫方式 / Contact： |
| 臺大產學合作總中心 / Center of Industry-Academia Collaboration, NTU |
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| Email：ordiac@ntu.edu.tw |
電話/Tel：02-3366-9945 |
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專利行銷平台