技術摘要 / Our Technology: |
本發明提出一種可微型化之被動式熱聲散熱裝置,其包含有有一溫差元件、一熱傳導元件與共振腔;共振腔為聲波共振產生駐波的範圍,溫差元件位於共振腔內,是可將熱能轉化為聲能的元件,熱傳導元件一端連接被散熱元件,一端接溫差元件,熱傳導元件傳導被散熱元件之熱能至溫差元件一端,在溫差元件上形成溫度梯度啟動熱聲機制,產生空氣對流對被散熱物體散熱。
A passive thermoacoustic cooling apparatus that could be miniaturized for cooling of microelectronics components was proposed. The passive thermoacoustic cooling apparatus is composed of a resonant chamber, a temperature-difference element and a heat conduction element. The temperature-difference element is situated in the resonant chamber and could transfer heat into acoustic power. The heat conducting element connects heat load and the temperature-difference element. The heat conducting element transmits heat from heat load to one end of the temperature-difference component. By forming temperature gradient on the temperature-difference element, acoustic standing wave is formed in the resonant chamber. Therefore, forced air convection is generated to cool the heat load.
|
專利簡述 / Intellectual Properties: |
|
|
聯繫方式 / Contact: |
臺大產學合作總中心 / Center of Industry-Academia Collaboration, NTU |
|
Email:ordiac@ntu.edu.tw |
電話/Tel:02-3366-9945 |
|
|
|
|