 技術摘要 / Our Technology： |
一種微小結構的自組裝方法，其係使用一接合材料使該微小結構藉由一物理性吸引力接合於基材上。接著，再進一步藉由焊料凸塊經迴焊形成一焊料球，使該微小結構進行自對位組裝，藉以使微小結構得以永久性的接合於基材上，並形成電性連接。根據本發明所指出的方法無需使用傳統的取放裝置。本發明方法可應用於發光二極體、無線標籤、微積體電路或其他型式的微小結構。
The present invention provides a method for self-assembling microstructure, which comprises using a bonding material to bond the microstructure onto a substrate by a physical attraction force; next, using the solder bump through the reflow process to form a solder ball; and making the microstructure having self-alignment and assembly, so as to permanently bond the microstructure onto the substrate and form the electrical connection. The method according to the present invention does not need the conventional pick-and-place device, so the method could be applied for light emitting diode, wireless tag, micro integrated circuit, or other forms of microstructures.
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| 專利簡述 / Intellectual Properties： |
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聯繫方式 / Contact： |
| 臺大產學合作總中心 / Center of Industry-Academia Collaboration, NTU |
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| Email：ordiac@ntu.edu.tw |
電話/Tel：02-3366-9945 |
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專利行銷平台