 技術摘要 / Our Technology： |
一種用於雷射加工之光學蝕刻裝置,其包括雷射光源以及光學頭。雷射光源發射入射光,而光學頭包括透光基層、不透光薄膜以及次波長環孔。其中,透光基層之雷射承受能量之範圍在8 J/cm2到12 J/cm2之間,不透光薄膜具有第一表面和與第一表面相對的第二表面,其中透光基層貼附於第一表面上,次波長環孔形成於不透光薄膜中,由第一表面延伸至第二表面,能使透光基層往不透光薄膜行進之入射光於不透光薄膜上產生表面電漿波。
An optical etching device for laser machining is provided and includes a laser light source and an optical head. The laser light source emits an incident beam. The optical head includes a transparent substrate, an opaque film and a sub-wavelength annular channel. The laser energy tolerance of the transparent substrate ranges from 8 J/cm2 to 12 J/cm2. The opaque film has a first surface and a second surface opposite to the first surface. The transparent substrate is adhered to the first surface. The sub-wavelength annular channel is formed in the opaque film and extends from the first surface to the second surface so that the incident beam from the transparent substrate generates a surface plasma wave on the opaque film.
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| 專利簡述 / Intellectual Properties： |
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聯繫方式 / Contact： |
| 臺大產學合作總中心 / Center of Industry-Academia Collaboration, NTU |
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| Email：ordiac@ntu.edu.tw |
電話/Tel：02-3366-9945 |
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專利行銷平台